The Basics of Semiconductor Dicing

Semiconductor dicing is a process used in the manufacture of electronic components. It is used to separate the die from the wafer. There are various methods for dicing a semiconductor wafer, such as mechanical sawing, laser cutting, and scribing and breaking. Here are some of the basics you should know about semiconductor dicing. Read on to learn more! And don’t forget to check out our video tutorial on semiconductor dicing.

Process of dicing a semiconductor wafer

The process of dicing a semiconductor wafer is vital to the production of high-quality devices. Typically, the process involves using a sharp blade to cut a semiconductor wafer, usually 75 micrometers wide, into smaller pieces. These pieces are then packaged in sanitary bags. After the process is complete, the silicon wafers are packaged for shipment. The width and blade thickness of dicing tools vary, and the finished product can be as narrow as 0.1mm.

The first step of the dicing process involves using a pulsed Nd: YAG laser. The wavelength of this laser is chosen to match the band gap of silicon, making it ideal for this task. The optical focus of the beam enables the laser to be aimed at different depths on the wafer, resulting in defect regions of approximately 10 um in width. Figure 3 shows an optical micrograph of the cleavage plane.

Die handling equipment

Proper die handling equipment is necessary for the semiconductor dicing process. Bare die is delicate and requires special handling techniques to avoid scratches, chips, cracks, and latent electrical defects. During the dicing process, the wafers are handled on a grounded workstation. The wafers are also washed with DI water and blown dry with nitrogen. Generally, a wafer has between 100 and 50,000 pieces of the good die.

Pick and place equipment is another option. This equipment has a video screen to help the operator to position the pick and place the collet over the center of the die. The vacuum collet then lifts the die from the tape frame and places it in the carrier. Manual loading cannot be done with the same consistency and accuracy as pick and place equipment. Moreover, manual loading of dies requires a significant amount of time and is not efficient.

Blade selection

To get the best out of dicing machines, it is essential to understand the underlying principles of blade selection. The blade must be suited to the type of wafer and the RPMs of the spindle of the dicing machine. This is because the blade wear and chip formation are correlated. Moreover, chipping on the back side is more pronounced when the blade torque is higher. The best way to achieve the desired feed rate without causing chip formation is to measure the blade torque.

After choosing a blade, the process parameters for the semiconductor dicing should be optimized. For example, blade thickness and width are determined by the demands of the wafer. Other parameters include the diamond size, diamond concentration, and shape of the edge. If you plan to use the same blade for various applications, consult the manufacturer about suitable blades for your needs. Blades with variable diamond concentration are highly recommended, and it is essential to understand the characteristics of dicing machines and the materials they can cut.

Blade life

One of the most important factors that influence the blade life of semiconductor dicing machines is the type of bonding material. While blades with a softer bond material typically produce better cuts, they wear more quickly. Therefore, a trade-off must be made between chip size and blade wear. By monitoring all of these parameters, the DOE can determine the appropriate compromise. The following are some tips to improve blade life. They will also increase productivity.

When cutting silicon, the amount of coolant used isn’t very important. Most dicing saw operators use deionized water. However, CO2 conductivity is vital for wafers that are susceptible to electrostatic charges. The angle of the coolant flow is also a factor in determining blade life and performance. The angle of coolant flow, as well as the direction in which the coolant flows, will affect the performance of the blade.

Cost of Ownership

The cost of semiconductor dicing is high, largely due to the need for constant performance and uptime. Since this work is so delicate and precise, even the smallest hiccup can cause a diagnostic pause, causing a significant increase in the total cost of ownership. This article will discuss the factors that contribute to determining the cost of semiconductor dicing ownership. Ultimately, your decision will depend on your particular requirements.