How To Provide Quality Wafer Dicing Services
Dicing is the procedure of cutting thin sheets of a durable material, such as plastic, metal, or paper. Dicing machines offer a variety of different types of wafer-dicing services to meet any organization’s needs. These include paper, aluminum, tin, copper, zinc, and stainless steel. Dicing work usually includes sheet die reduction, wafer inspection, sheet tape die reduction, wire EDM coating, foil EDM coating, and bonding.
Paper wafer dicing services include chipping, nailing, perforating, and mounting. Chipping refers to removal of the uppermost layer of the wafer, which is done by applying a mechanical press to remove the surplus plastic from the wafer. Nail is a similar method that is often used to remove the excess plastic from thin-set wafers. Perforating involves perforating a thin sheet of metal through a solvent-based cleaning compound.
Dip coating and plunge cuts are two other common wafer dicing services. Dip coating involves spraying a specially-formulated coating that bonds with the surface of the wafer and provides adhesive for easy removal. Sperse cuts are another common type of dicing service. In this process, a blade is used to cut a number of parallel slits in the wafer. These are then coated with a thin layer of water.
Di water is a hard, viscous compound that is commonly used to coat metal surfaces. It has excellent adhesive power and improves the adhesion properties of plastics and metals. There are four main types of dip coating cuts: perforated slotted, beveled, and thrust cuts. Perforated and slitted cuts are considered safe because they cause little or no surface damage. Beveled cuts, on the other hand, can be very dangerous as the small perforations can easily lodge tiny objects into the wafer. thrust cuts are very dangerous, as they are meant for use with hot molten metals.
The standard performance of a mechanical saw for wafer dicing services is the ability to make ten slits per inch. For thinner materials, this can be increased to fifteen slits per inch. Common saw speeds for ten-inch cuts using mechanical sawing are: 485 rpm for standard machines; and higher for industrial saws equipped with diamond grinding motors. To prevent blunt cuts and to maximize its strength, diamond blades are often diamond-tipped.
Wafer cutting services ensure excellent appearance of wafer prototypes and final product. When using a professional cutter, the wafers can be quickly deformed and polished to create smooth, even surfaces and uniform thickness. By placing individual dies into the wafer, the process allows manufacturers to produce several thousands of identical wafers without any variations. The finished product will have consistent dimensions and shape.
When chipping, a rough surface is not needed and the entire product is quickly finished. Most often, a rough finish is used when wafers are being cut in bulk, since a flat surface is easier to work with. Other commonly used finishes include hot lamination and powder coating. Powder coating is the most commonly used technique and can provide excellent results for less expensive products, though powder coating does require practice and experience.
It is important to note that wafer dicing is an integral process for the design of wafer prototypes. Without this step, it is impossible to manufacture large-scale wafers or circuit boards. In addition, the procedure is an important part of the fabrication process. It is frequently used as a way to add fineness to the surfaces of the wafer prototypes, as well as to create subtle differences in surface texture. Since it can be performed on a production scale, wafer dicing is a very valuable service for chip and wafer design and manufacturing companies.
