Solder Bump Vertical Probe Cards are an important part of the wafer-level test process. Sensitive devices, including flip chip die and those using low-k dielectrics, require special attention to avoid damage during testing. Traditionally, probe card manufacturers have reduced contact force by improving planarity, changing the shape of the probe tip, and introducing new probe tip materials. However, the required contact force is still too high for these probes to handle the number of pins on flip-chip devices that are being tested.